JANTXV1N4482US vs 1N4482TR feature comparison

JANTXV1N4482US Microchip Technology Inc

Buy Now Datasheet

1N4482TR Central Semiconductor Corp

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC CENTRAL SEMICONDUCTOR CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-PALF-W2
Reach Compliance Code compliant not_compliant
Factory Lead Time 28 Weeks
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-PALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.5 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 51 V 51 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 1 3
Pbfree Code No
ECCN Code EAR99
HTS Code 8541.10.00.50
Dynamic Impedance-Max 60 Ω
JEDEC-95 Code DO-41
Knee Impedance-Max 1100 Ω
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Reverse Current-Max 0.05 µA
Reverse Test Voltage 40.8 V

Compare JANTXV1N4482US with alternatives

Compare 1N4482TR with alternatives