JANTXV1N4477US
vs
MSP1N5255AUR-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
1.5 W
|
|
| Qualification Status |
Not Qualified
|
|
| Reference Standard |
MIL-19500
|
|
| Reference Voltage-Nom |
33 V
|
|
| Surface Mount |
YES
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WRAP AROUND
|
|
| Terminal Position |
END
|
|
| Voltage Tol-Max |
5%
|
|
| Working Test Current |
7.5 mA
|
|
| Base Number Matches |
7
|
1
|
| Part Package Code |
|
DO-213AA
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
|
|
|
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