JANTXV1N4464CUS
vs
1N4464C
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, GLASS, D-5A, 2 PIN
|
HERMETIC SEALED, GLASS PACKAGE-2
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
28 Weeks
|
28 Weeks
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
O-LELF-R2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
1.5 W
|
1.5 W
|
Qualification Status |
Qualified
|
|
Reference Standard |
MIL-19500/406F
|
|
Reference Voltage-Nom |
9.1 V
|
9.1 V
|
Surface Mount |
YES
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WIRE
|
Terminal Position |
END
|
AXIAL
|
Voltage Tol-Max |
2%
|
2%
|
Working Test Current |
28 mA
|
28 mA
|
Base Number Matches |
3
|
3
|
Additional Feature |
|
METALLURGICALLY BONDED
|
JEDEC-95 Code |
|
DO-41
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare JANTXV1N4464CUS with alternatives
Compare 1N4464C with alternatives