JANTXV1N3614US
vs
EGL41D-E3/97
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
VISHAY INTERTECHNOLOGY INC
|
| Part Package Code |
MELF
|
|
| Package Description |
O-LELF-R2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.80
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
FREE WHEELING DIODE; HIGH RELIABILITY
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/286
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
1
|
2
|
| Factory Lead Time |
|
8 Weeks
|
| Application |
|
EFFICIENCY
|
| Forward Voltage-Max (VF) |
|
1 V
|
| JEDEC-95 Code |
|
DO-213AB
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Pk Forward Current-Max |
|
30 A
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Rep Pk Reverse Voltage-Max |
|
200 V
|
| Reverse Current-Max |
|
5 µA
|
| Reverse Recovery Time-Max |
|
0.05 µs
|
| Reverse Test Voltage |
|
200 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare JANTXV1N3614US with alternatives
Compare EGL41D-E3/97 with alternatives