JANTX1N973B-1
vs
CD973B
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-35
Package Description
HERMETICALLY SEALED, GLASS PACKAGE-2
DIE-2
Pin Count
1
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
JESD-30 Code
O-LALF-W2
S-XUUC-N1
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
SQUARE
Package Style
LONG FORM
UNCASED CHIP
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/117
Reference Voltage-Nom
33 V
33 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
NO LEAD
Terminal Position
AXIAL
UNSPECIFIED
Voltage Tol-Max
5%
5%
Working Test Current
3.8 mA
3.8 mA
Base Number Matches
2
1
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Compare CD973B with alternatives