JANTX1N821-1
vs
1N3779
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
MICROSEMI CORP
Package Description
HERMETIC SEALED PACKAGE-2
O-XALF-W2
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-7
JESD-30 Code
O-XALF-W2
O-XALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/159M
Reference Voltage-Nom
6.2 V
6.7 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.62 mV/°C
1.005 mV/°C
Voltage Tol-Max
4.84%
5%
Base Number Matches
12
6
Pbfree Code
Rohs Code
Part Package Code
DO-7
Pin Count
2
Samacsys Manufacturer
Microsemi Corporation
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