JANTX1N747CUR-1
vs
JANTXV1N747CUR-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
COMPENSATED DEVICES INC
Package Description
MELF-2
Reach Compliance Code
compliant
unknown
Factory Lead Time
20 Weeks
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
22 Ω
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
3.6 V
3.6 V
Reverse Current-Max
3 µA
Reverse Test Voltage
1 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
2%
2%
Working Test Current
20 mA
20 mA
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare JANTX1N747CUR-1 with alternatives
Compare JANTXV1N747CUR-1 with alternatives