JANTX1N6631
vs
1N6631
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, GLASS, E, 2 PIN
|
HERMETIC SEALED, GLASS, E, 2 PIN
|
Reach Compliance Code |
compliant
|
compliant
|
Additional Feature |
METALLURGICALLY BONDED, HIGH RELIABILITY
|
METALLURGICALLY BONDED, HIGH RELIABILITY
|
Application |
ULTRA FAST RECOVERY
|
ULTRA FAST RECOVERY
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e0
|
Non-rep Pk Forward Current-Max |
60 A
|
60 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Output Current-Max |
1.4 A
|
1.4 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/590
|
|
Reverse Recovery Time-Max |
0.08 µs
|
0.08 µs
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
4
|
12
|
Factory Lead Time |
|
24 Weeks
|
|
|
|
Compare JANTX1N6631 with alternatives
Compare 1N6631 with alternatives