JANTX1N6622
vs
1N6622E3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS, A, 2 PIN
ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, 2 PIN
Pin Count
2
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.80
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
HIGH RELIABILITY
HIGH RELIABILITY, METALLURGICALLY BONDED
Application
ULTRA FAST RECOVERY
ULTRA FAST RECOVERY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1.6 V
JEDEC-95 Code
DO-41
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e3
Non-rep Pk Forward Current-Max
20 A
20 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
Operating Temperature-Min
-65 °C
Output Current-Max
1.2 A
1.2 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500
Rep Pk Reverse Voltage-Max
600 V
600 V
Reverse Current-Max
0.5 µA
Reverse Recovery Time-Max
0.045 µs
0.045 µs
Surface Mount
NO
NO
Technology
AVALANCHE
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
3
1
Factory Lead Time
24 Weeks
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