JANTX1N5969D
vs
JAN1N5969D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
HERMETIC SEALED, PLASTIC, E PACKAGE-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
52 Weeks
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/356H
MIL-19500/356
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
1%
1%
Working Test Current
220 mA
220 mA
Base Number Matches
2
2
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
HIGH RELIABILITY
Dynamic Impedance-Max
1 Ω
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare JANTX1N5969D with alternatives
Compare JAN1N5969D with alternatives