JANTX1N5621US
vs
BYM13-30-E3/97
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
VISHAY SEMICONDUCTORS
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-PELF-R2
Reach Compliance Code
compliant
unknown
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LELF-R2
O-PELF-R2
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Output Current-Max
1 A
1 A
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/429J
Reverse Recovery Time-Max
0.3 µs
Surface Mount
YES
YES
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
4
2
Pbfree Code
Part Package Code
DO-213AB
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.80
Additional Feature
LOW POWER LOSS, FREE WHEELING DIODE
Forward Voltage-Max (VF)
0.5 V
JEDEC-95 Code
DO-213AB
JESD-609 Code
e3
Moisture Sensitivity Level
1
Non-rep Pk Forward Current-Max
30 A
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Peak Reflow Temperature (Cel)
250
Rep Pk Reverse Voltage-Max
30 V
Technology
SCHOTTKY
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare JANTX1N5621US with alternatives
Compare BYM13-30-E3/97 with alternatives