JANTX1N5301UR
vs
JANTX1N5301UR-1
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
Part Package Code |
DO-213AB
|
|
Package Description |
O-XELF-R2
|
|
Pin Count |
2
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
Dynamic Impedance-Min |
540000 Ω
|
|
JEDEC-95 Code |
DO-213AB
|
DO-213AB
|
JESD-30 Code |
O-XELF-R2
|
O-XELF-R2
|
JESD-609 Code |
e0
|
|
Limiting Voltage-Max |
1.55 V
|
1.55 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Qualified
|
Regulation Current-Nom (Ireg) |
1.4 mA
|
1.4 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Base Number Matches |
2
|
8
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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