JANTX1N3047CUR-1 vs JANTXV1N3047CUR-1 feature comparison

JANTX1N3047CUR-1 Microchip Technology Inc

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JANTXV1N3047CUR-1 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description DO-213AB, 2 PIN DO-213AB, 2 PIN
Reach Compliance Code compliant unknown
Factory Lead Time 20 Weeks
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 700 Ω 700 Ω
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500 MIL-19500
Reference Voltage-Nom 130 V 130 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 1.9 mA 1.9 mA
Base Number Matches 1 1
Part Package Code DO-213AB
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50

Compare JANTX1N3047CUR-1 with alternatives

Compare JANTXV1N3047CUR-1 with alternatives