JANTX1N2804 vs 1N4555R feature comparison

JANTX1N2804 Microsemi Corporation

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1N4555R Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Part Package Code TO-3
Package Description O-MBFM-P2 HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
Pin Count 2
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ANODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code TO-204AD DO-203AB
JESD-30 Code O-MBFM-P2 O-MUPM-D1
Number of Elements 1 1
Number of Terminals 2 1
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style FLANGE MOUNT POST/STUD MOUNT
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 50 W 50 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/114
Reference Voltage-Nom 6.8 V 6.8 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form PIN/PEG SOLDER LUG
Terminal Position BOTTOM UPPER
Voltage Tol-Max 20% 20%
Working Test Current 1850 mA 1850 mA
Base Number Matches 1 8
Additional Feature PD-CASE
Dynamic Impedance-Max 0.16 Ω
Knee Impedance-Max 200 Ω
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reverse Current-Max 10 µA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Temp Coeff-Max 3.604 mV/°C

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