JANS1N6639US
vs
JANTX1N6639U
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
MICROSEMI CORP
Package Description
SURFACE MOUNT PACKAGE-2
O-XELF-R2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-XELF-R2
O-XELF-R2
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Output Current-Max
0.3 A
0.3 A
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/609D
Reverse Recovery Time-Max
0.004 µs
0.004 µs
Surface Mount
YES
YES
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
10
6
Pin Count
2
JESD-609 Code
e0
Rep Pk Reverse Voltage-Max
75 V
Terminal Finish
TIN LEAD
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