JANS1N6486
vs
1N4761CURTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-LELF-R2
Reach Compliance Code
compliant
unknown
Factory Lead Time
24 Weeks
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
TR, 7 INCH; 1500
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
DO-213AB
JESD-30 Code
O-LALF-W2
O-LELF-R2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
3.6 V
75 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
WIRE
WRAP AROUND
Terminal Position
AXIAL
END
Voltage Tol-Max
5%
2%
Working Test Current
69 mA
3.3 mA
Base Number Matches
4
6
Part Package Code
DO-213AB
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
175 Ω
Moisture Sensitivity Level
1
Compare JANS1N6486 with alternatives
Compare 1N4761CURTR with alternatives