JANS1N6165US
vs
1N6165USE3
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, SURFACE MOUNT PACKAGE-2
|
O-LELF-R2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Breakdown Voltage-Min |
81.9 V
|
82.18 V
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
O-XELF-N2
|
O-LELF-R2
|
| JESD-609 Code |
e0
|
e3
|
| Non-rep Peak Rev Power Dis-Max |
1500 W
|
1500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
BIDIRECTIONAL
|
| Power Dissipation-Max |
7.5 W
|
3 W
|
| Qualification Status |
Not Qualified
|
|
| Reference Standard |
MIL-19500/516
|
IEC-61000-4-2, 4-4, 4-5
|
| Rep Pk Reverse Voltage-Max |
69.2 V
|
69.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
AVALANCHE
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
5
|
1
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-55 °C
|
|
|
|
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