JANS1N5802
vs
JANKCE1N5802
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, GLASS, A PACKAGE-2
|
DIE-1
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.40
|
| Additional Feature |
HIGH RELIABILITY
|
|
| Application |
GENERAL PURPOSE
|
FAST RECOVERY
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
O-LALF-W2
|
S-XUUC-N1
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
1
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
1 A
|
2.5 A
|
| Package Body Material |
GLASS
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
SQUARE
|
| Package Style |
LONG FORM
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500
|
|
| Rep Pk Reverse Voltage-Max |
50 V
|
|
| Reverse Recovery Time-Max |
0.025 µs
|
0.025 µs
|
| Surface Mount |
NO
|
YES
|
| Technology |
AVALANCHE
|
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WIRE
|
NO LEAD
|
| Terminal Position |
AXIAL
|
UPPER
|
| Base Number Matches |
8
|
8
|
| Part Package Code |
|
DIE
|
| Pin Count |
|
1
|
|
|
|
Compare JANS1N5802 with alternatives
Compare JANKCE1N5802 with alternatives