JANS1N5308UR-1
vs
1N5308UR-1E3
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
HERMETIC SEALED, GLASS, LL41, MELF-2
|
ROHS COMPLIANT, HERMETIC SEALED, GLASS, LL41, MELF-2
|
Reach Compliance Code |
compliant
|
compliant
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JEDEC-95 Code |
DO-213AB
|
DO-213AB
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e3
|
Limiting Voltage-Max |
2.15 V
|
2.15 V
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Qualified
|
|
Reference Standard |
MIL-19500
|
|
Regulation Current-Nom (Ireg) |
2.7 mA
|
2.7 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.70
|
|
|
|
Compare JANS1N5308UR-1 with alternatives
Compare 1N5308UR-1E3 with alternatives