JANS1N5299-1
vs
JANHCA1N5299
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
DO-35, 2 PIN
|
HERMETIC SEALED, DIE-2
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
32 Weeks
|
|
Case Connection |
ISOLATED
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
Dynamic Impedance-Min |
640000 Ω
|
|
JEDEC-95 Code |
DO-7
|
|
JESD-30 Code |
O-LALF-W2
|
S-XXUC-N2
|
JESD-609 Code |
e0
|
e0
|
Limiting Voltage-Max |
1.45 V
|
1.45 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
SQUARE
|
Package Style |
LONG FORM
|
UNCASED CHIP
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Qualified
|
Qualified
|
Reference Standard |
MIL-PRF-19500
|
MIL-19500/463G
|
Regulation Current-Nom (Ireg) |
1.2 mA
|
1.2 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
NO
|
YES
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
WIRE
|
NO LEAD
|
Terminal Position |
AXIAL
|
UNSPECIFIED
|
Base Number Matches |
2
|
1
|
|
|
|
Compare JANS1N5299-1 with alternatives
Compare JANHCA1N5299 with alternatives