JANS1N4493DUS
vs
JAN1N4493US
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
HERMETIC SEALED, GLASS, D-5A, 2 PIN
|
HERMETIC SEALED, GLASS PACKAGE-2
|
Reach Compliance Code |
compliant
|
unknown
|
Factory Lead Time |
32 Weeks
|
|
Additional Feature |
HIGH RELIABILITY, METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
1.5 W
|
1.5 W
|
Qualification Status |
Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/406
|
MIL-19500
|
Reference Voltage-Nom |
150 V
|
150 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Voltage Tol-Max |
1%
|
5%
|
Working Test Current |
1.7 mA
|
1.7 mA
|
Base Number Matches |
1
|
3
|
Pbfree Code |
|
No
|
Pin Count |
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.50
|
|
|
|
Compare JANS1N4493DUS with alternatives
Compare JAN1N4493US with alternatives