JANS1N4468D
vs
1N3023B-1E3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-LALF-W2
Reach Compliance Code
compliant
compliant
Factory Lead Time
32 Weeks
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1 W
Qualification Status
Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
13 V
13 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
PURE MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
1%
5%
Working Test Current
19 mA
19 mA
Base Number Matches
3
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
10 Ω
Compare JANS1N4468D with alternatives
Compare 1N3023B-1E3 with alternatives