JANS1N4466C
vs
1N4466USE3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
32 Weeks
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
JESD-30 Code
O-LALF-W2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Qualification Status
Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
11 V
11 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
PURE MATTE TIN
Terminal Form
WIRE
WRAP AROUND
Terminal Position
AXIAL
END
Voltage Tol-Max
2%
5%
Working Test Current
23 mA
23 mA
Base Number Matches
3
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
6 Ω
Compare JANS1N4466C with alternatives
Compare 1N4466USE3 with alternatives