JANS1N4466 vs 1N4466E3 feature comparison

JANS1N4466 Microsemi Corporation

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1N4466E3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-LALF-W2
Reach Compliance Code unknown compliant
Additional Feature HIGH RELIABILITY, METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-41 DO-41
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.5 W
Qualification Status Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 11 V 11 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 23 mA 23 mA
Base Number Matches 6 1
ECCN Code EAR99
HTS Code 8541.10.00.50
Dynamic Impedance-Max 6 Ω

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