JANS1N4118-1
vs
1N4118(DO35)E3
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
M/A-COM TECHNOLOGY SOLUTIONS INC
|
MICROSEMI CORP
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Additional Feature |
LOW NOISE, METALLURGICALLY BONDED
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-35
|
DO-35
|
JESD-30 Code |
O-LALF-W2
|
O-XALF-W2
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.25 W
|
Qualification Status |
Qualified
|
|
Reference Standard |
MIL-19500
|
|
Reference Voltage-Nom |
27 V
|
27 V
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
0.25 mA
|
250 mA
|
Base Number Matches |
10
|
1
|
Package Description |
|
O-XALF-W2
|
|
|
|
Compare 1N4118(DO35)E3 with alternatives