JANKCA1N829
vs
1N829T/R
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
Package Description |
HERMETIC SEALED, DIE-3
|
O-LALF-W2
|
Reach Compliance Code |
compliant
|
unknown
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
S-XUUC-N3
|
O-LALF-W2
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
2
|
Package Body Material |
UNSPECIFIED
|
GLASS
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Power Dissipation-Max |
0.5 W
|
0.4 W
|
Qualification Status |
Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/159M
|
|
Reference Voltage-Nom |
6.2 V
|
6.2 V
|
Surface Mount |
YES
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
NO LEAD
|
WIRE
|
Terminal Position |
UPPER
|
AXIAL
|
Voltage Tol-Max |
5%
|
5%
|
Base Number Matches |
4
|
1
|
Part Package Code |
|
DO-34
|
Pin Count |
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.50
|
Case Connection |
|
ISOLATED
|
JEDEC-95 Code |
|
DO-34
|
Operating Temperature-Max |
|
100 °C
|
Operating Temperature-Min |
|
-55 °C
|
Voltage Temp Coeff-Max |
|
0.031 mV/°C
|
|
|
|
Compare JANKCA1N829 with alternatives
Compare 1N829T/R with alternatives