JANKCA1N5712
vs
JANTXV1N5712-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
| Case Connection |
CATHODE
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
S-XUUC-N2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
0.075 A
|
0.075 A
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
SQUARE
|
ROUND
|
| Package Style |
UNCASED CHIP
|
LONG FORM
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UPPER
|
AXIAL
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
DO-35
|
| Package Description |
|
HERMETIC SEALED, GLASS PACKAGE-2
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.70
|
| JEDEC-95 Code |
|
DO-35
|
| Reference Standard |
|
MIL-19500/444
|
| Technology |
|
SCHOTTKY
|
|
|
|
Compare JANKCA1N5712 with alternatives
Compare JANTXV1N5712-1 with alternatives