JANKCA1N5711
vs
JANHCA1N5711
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
DEFENSE LOGISTICS AGENCY
|
| Part Package Code |
DIE
|
|
| Package Description |
DIE-2
|
DIE-2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.40
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.41 V
|
|
| JESD-30 Code |
S-XUUC-N2
|
S-XUUC-N2
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
100 °C
|
|
| Output Current-Max |
0.033 A
|
0.033 A
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Rep Pk Reverse Voltage-Max |
70 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
1
|
1
|
| Reference Standard |
|
MIL-19500/444H
|
|
|
|
Compare JANKCA1N5711 with alternatives
Compare JANHCA1N5711 with alternatives