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JANKCA1N5540B vs JANKCA1N5540B feature comparison

JANKCA1N5540B Microchip Technology Inc

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JANKCA1N5540B Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description DIE-2 DIE-2
Reach Compliance Code compliant unknown
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection CATHODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 100 Ω 100 Ω
JESD-30 Code S-XXUC-N2 S-XXUC-N2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape SQUARE SQUARE
Package Style UNCASED CHIP UNCASED CHIP
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/437E MIL-19500/437E
Reference Voltage-Nom 20 V 20 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position UNSPECIFIED UNSPECIFIED
Voltage Tol-Max 5% 5%
Working Test Current 1 mA 1 mA
Base Number Matches 1 1
Pbfree Code No
Part Package Code DIE
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Diodes » Zener Diodes
Diodes » Zener Diodes