JANKCA1N5313
vs
1N5313TRPBFREE
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
CENTRAL SEMICONDUCTOR CORP
|
Part Package Code |
DIE
|
|
Package Description |
HERMETIC SEALED, DIE-2
|
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.40
|
|
Case Connection |
CATHODE
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
Dynamic Impedance-Min |
245000 Ω
|
245000 Ω
|
JESD-30 Code |
S-XXUC-N2
|
|
JESD-609 Code |
e0
|
|
Limiting Voltage-Max |
2.75 V
|
2.75 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
|
Package Body Material |
UNSPECIFIED
|
|
Package Shape |
SQUARE
|
|
Package Style |
UNCASED CHIP
|
|
Power Dissipation-Max |
0.6 W
|
0.6 W
|
Qualification Status |
Not Qualified
|
|
Reference Standard |
MIL-19500/463G
|
|
Regulation Current-Nom (Ireg) |
4.3 mA
|
4.3 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
YES
|
NO
|
Technology |
FIELD EFFECT
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
|
Terminal Position |
UNSPECIFIED
|
|
Base Number Matches |
2
|
1
|
|
|
|
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