JANKCA1N5309
vs
JAN1N5309
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
KNOX SEMICONDUCTORS INC
|
| Package Description |
HERMETIC SEALED, DIE-2
|
O-LALF-W2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.40
|
8541.10.00.70
|
| Case Connection |
CATHODE
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| Dynamic Impedance-Min |
300000 Ω
|
300000 Ω
|
| JESD-30 Code |
S-XXUC-N2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
e0
|
| Limiting Voltage-Max |
2.25 V
|
2.25 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
SQUARE
|
ROUND
|
| Package Style |
UNCASED CHIP
|
LONG FORM
|
| Power Dissipation-Max |
0.6 W
|
0.5 W
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/463G
|
MIL-19500/463
|
| Regulation Current-Nom (Ireg) |
3 mA
|
3 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UNSPECIFIED
|
AXIAL
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
DO-7
|
| Pin Count |
|
2
|
| JEDEC-95 Code |
|
DO-7
|
| Knee Impedance-Max |
|
29000 Ω
|
| Operating Temperature-Max |
|
200 °C
|
| Operating Temperature-Min |
|
-55 °C
|
|
|
|
Compare JANKCA1N5309 with alternatives
Compare JAN1N5309 with alternatives