JANKCA1N5309
vs
JAN1N5309
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Contact Manufacturer
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
CRYSTALONICS INC
Package Description
HERMETIC SEALED, DIE-2
O-LALF-W2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.40
8541.10.00.70
Case Connection
CATHODE
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
Dynamic Impedance-Min
300000 Ω
JESD-30 Code
S-XXUC-N2
O-LALF-W2
JESD-609 Code
e0
Limiting Voltage-Max
2.25 V
2.25 V
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Power Dissipation-Max
0.6 W
0.6 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/463G
Regulation Current-Nom (Ireg)
3 mA
3 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
YES
NO
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UNSPECIFIED
AXIAL
Base Number Matches
1
1
Part Package Code
DO-7
Pin Count
2
JEDEC-95 Code
DO-7
Operating Temperature-Max
200 °C
Operating Temperature-Min
-55 °C
Compare JANKCA1N5309 with alternatives
Compare JAN1N5309 with alternatives