JANKCA1N5307
vs
JANC1N5307
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Part Package Code |
DIE
|
DIE
|
| Package Description |
HERMETIC SEALED, DIE-2
|
DIE-1
|
| Pin Count |
2
|
1
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.40
|
8541.10.00.40
|
| Case Connection |
CATHODE
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| Dynamic Impedance-Min |
345000 Ω
|
|
| JESD-30 Code |
S-XXUC-N2
|
R-XUUC-N1
|
| JESD-609 Code |
e0
|
e0
|
| Limiting Voltage-Max |
2 V
|
2 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
1
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Power Dissipation-Max |
0.6 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/463G
|
MIL-19500/463
|
| Regulation Current-Nom (Ireg) |
2.4 mA
|
2.4 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UNSPECIFIED
|
UPPER
|
| Base Number Matches |
2
|
2
|
|
|
|
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