JANKCA1N4581A
vs
JAN1N4581A-1
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
Part Package Code |
DIE
|
|
Package Description |
HERMETIC SEALED, DIE-3
|
HERMETIC SEALED PACKAGE-2
|
Pin Count |
3
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
S-XUUC-N3
|
O-XALF-W2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
2
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Standard |
MIL-19500/452G
|
MIL-19500/452
|
Reference Voltage-Nom |
6.4 V
|
6.4 V
|
Surface Mount |
YES
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
WIRE
|
Terminal Position |
UPPER
|
AXIAL
|
Voltage Tol-Max |
5%
|
5%
|
Base Number Matches |
3
|
7
|
Case Connection |
|
ISOLATED
|
JEDEC-95 Code |
|
DO-35
|
Voltage Temp Coeff-Max |
|
0.32 mV/°C
|
|
|
|
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