JANKCA1N4574A
vs
JANHCA1N4574A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DIE
DIE
Package Description
HERMETIC SEALED, DIE-3
HERMETIC SEALED, DIE-3
Pin Count
3
3
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
S-XUUC-N3
S-XUUC-N3
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
3
3
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
SQUARE
SQUARE
Package Style
UNCASED CHIP
UNCASED CHIP
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/452G
MIL-19500/452G
Reference Voltage-Nom
6.4 V
6.4 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Voltage Tol-Max
5%
5%
Base Number Matches
3
3
Compare JANKCA1N4574A with alternatives
Compare JANHCA1N4574A with alternatives