JANKCA1N4574A vs JANHCA1N4574A feature comparison

JANKCA1N4574A Microsemi Corporation

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JANHCA1N4574A Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DIE DIE
Package Description HERMETIC SEALED, DIE-3 HERMETIC SEALED, DIE-3
Pin Count 3 3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code S-XUUC-N3 S-XUUC-N3
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 3 3
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape SQUARE SQUARE
Package Style UNCASED CHIP UNCASED CHIP
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/452G MIL-19500/452G
Reference Voltage-Nom 6.4 V 6.4 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Voltage Tol-Max 5% 5%
Base Number Matches 3 3

Compare JANKCA1N4574A with alternatives

Compare JANHCA1N4574A with alternatives