JANHCF1N5806
vs
JANS1N5806
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
SENSITRON SEMICONDUCTOR
|
| Part Package Code |
DIE
|
|
| Package Description |
S-XUUC-N1
|
HERMETIC SEALED, GLASS PACKAGE-2
|
| Pin Count |
1
|
2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.40
|
8541.10.00.80
|
| Application |
FAST RECOVERY
|
ULTRA FAST RECOVERY
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.875 V
|
0.875 V
|
| JESD-30 Code |
S-XUUC-N1
|
E-LALF-W2
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Output Current-Max |
2.5 A
|
2.5 A
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
SQUARE
|
ELLIPTICAL
|
| Package Style |
UNCASED CHIP
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Rep Pk Reverse Voltage-Max |
150 V
|
150 V
|
| Reverse Recovery Time-Max |
0.025 µs
|
0.025 µs
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UPPER
|
AXIAL
|
| Base Number Matches |
2
|
10
|
| Pbfree Code |
|
No
|
| Factory Lead Time |
|
36 Weeks
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Case Connection |
|
ISOLATED
|
| Non-rep Pk Forward Current-Max |
|
35 A
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Reference Standard |
|
MIL-19500
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare JANHCF1N5806 with alternatives
Compare JANS1N5806 with alternatives