JANHCA1N5543B
vs
1N5543B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MOTOROLA INC
Part Package Code
DIE
Package Description
DIE-2
O-LALF-W2
Pin Count
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
LOW NOISE, HIGH RELIABILITY
Case Connection
CATHODE
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
100 Ω
100 Ω
JESD-30 Code
S-XXUC-N2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
200 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/437E
Reference Voltage-Nom
25 V
25 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UNSPECIFIED
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
1 mA
1 mA
Base Number Matches
4
23
JEDEC-95 Code
DO-204AH
Operating Temperature-Min
-65 °C
Reverse Current-Max
0.01 µA
Compare JANHCA1N5543B with alternatives
Compare 1N5543B with alternatives