JANHCA1N5541B
vs
JAN1N5541BUR-1
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
DIE-2
|
HERMETIC SEALED, GLASS, MLL34, MELF-2
|
Reach Compliance Code |
compliant
|
compliant
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Case Connection |
CATHODE
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
S-XXUC-N2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
UNSPECIFIED
|
GLASS
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Qualified
|
Qualified
|
Reference Standard |
MIL-19500/437E
|
MIL-19500
|
Reference Voltage-Nom |
22 V
|
22 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
WRAP AROUND
|
Terminal Position |
UNSPECIFIED
|
END
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
1 mA
|
1 mA
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
20 Weeks
|
JEDEC-95 Code |
|
DO-213AA
|
Moisture Sensitivity Level |
|
1
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare JANHCA1N5541B with alternatives
Compare JAN1N5541BUR-1 with alternatives