JANHCA1N5522C vs JANTX1N5522C-1TR feature comparison

JANHCA1N5522C Microsemi Corporation

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JANTX1N5522C-1TR Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DIE DO-35
Package Description DIE-2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection CATHODE ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 22 Ω
JESD-30 Code S-XXUC-N2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/437E MIL-19500
Reference Voltage-Nom 4.7 V 4.7 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Voltage Tol-Max 2% 2%
Working Test Current 10 mA 10 mA
Base Number Matches 4 1
JEDEC-95 Code DO-204AH
Operating Temperature-Min -65 °C

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Compare JANTX1N5522C-1TR with alternatives