JANHCA1N5519B
vs
MSP1N5227BTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
DIE-2
HERMETIC SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code
compliant
unknown
Additional Feature
METALLURGICALLY BONDED
Case Connection
CATHODE
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
S-XXUC-N2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.417 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/437E
Reference Voltage-Nom
3.6 V
3.6 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UNSPECIFIED
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
4
1
Part Package Code
DO-7
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
JEDEC-95 Code
DO-204AA
Moisture Sensitivity Level
1
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare JANHCA1N5519B with alternatives
Compare MSP1N5227BTR with alternatives