JANHCA1N5313
vs
1N5313PBFREE
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
CENTRAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIE
|
|
| Package Description |
HERMETIC SEALED, DIE-2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.40
|
|
| Case Connection |
CATHODE
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| Dynamic Impedance-Min |
245000 Ω
|
|
| JESD-30 Code |
S-XXUC-N2
|
O-XALF-W2
|
| JESD-609 Code |
e0
|
e3
|
| Limiting Voltage-Max |
2.75 V
|
2.75 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
SQUARE
|
ROUND
|
| Package Style |
UNCASED CHIP
|
LONG FORM
|
| Power Dissipation-Max |
0.6 W
|
0.6 W
|
| Qualification Status |
Not Qualified
|
|
| Reference Standard |
MIL-19500/463G
|
|
| Regulation Current-Nom (Ireg) |
4.3 mA
|
4.3 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN OVER NICKEL
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UNSPECIFIED
|
AXIAL
|
| Base Number Matches |
3
|
1
|
| Date Of Intro |
|
2018-01-18
|
| Additional Feature |
|
HIGH RELIABILITY
|
| JEDEC-95 Code |
|
DO-35
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
200 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare JANHCA1N5313 with alternatives
Compare 1N5313PBFREE with alternatives