JANHCA1N5304 vs JANS1N5304-1 feature comparison

JANHCA1N5304 Microsemi Corporation

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JANS1N5304-1 Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Part Package Code DIE
Package Description HERMETIC SEALED, DIE-2 DO-35, 2 PIN
Pin Count 2
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8541.10.00.40
Case Connection CATHODE ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type CURRENT REGULATOR DIODE CURRENT REGULATOR DIODE
Dynamic Impedance-Min 420000 Ω 420000 Ω
JESD-30 Code S-XXUC-N2 O-LALF-W2
JESD-609 Code e0 e0
Limiting Voltage-Max 1.75 V 1.75 V
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Power Dissipation-Max 0.6 W 0.5 W
Qualification Status Not Qualified Qualified
Reference Standard MIL-19500/463G MIL-PRF-19500
Regulation Current-Nom (Ireg) 1.8 mA 1.8 mA
Rep Pk Reverse Voltage-Max 100 V 100 V
Surface Mount YES NO
Technology FIELD EFFECT FIELD EFFECT
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Base Number Matches 4 8
Factory Lead Time 32 Weeks
JEDEC-95 Code DO-7
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C

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