JANHCA1N5304
vs
JANS1N5304-1
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DIE
Package Description
HERMETIC SEALED, DIE-2
DO-35, 2 PIN
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.40
Case Connection
CATHODE
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
Dynamic Impedance-Min
420000 Ω
420000 Ω
JESD-30 Code
S-XXUC-N2
O-LALF-W2
JESD-609 Code
e0
e0
Limiting Voltage-Max
1.75 V
1.75 V
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Power Dissipation-Max
0.6 W
0.5 W
Qualification Status
Not Qualified
Qualified
Reference Standard
MIL-19500/463G
MIL-PRF-19500
Regulation Current-Nom (Ireg)
1.8 mA
1.8 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
YES
NO
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UNSPECIFIED
AXIAL
Base Number Matches
4
8
Factory Lead Time
32 Weeks
JEDEC-95 Code
DO-7
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare JANHCA1N5304 with alternatives
Compare JANS1N5304-1 with alternatives