JANHCA1N5301
vs
1N5301PBFREE
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
CENTRAL SEMICONDUCTOR CORP
|
Part Package Code |
DIE
|
|
Package Description |
HERMETIC SEALED, DIE-2
|
|
Pin Count |
2
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.40
|
|
Case Connection |
CATHODE
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JESD-30 Code |
S-XXUC-N2
|
O-XALF-W2
|
JESD-609 Code |
e0
|
e3
|
Limiting Voltage-Max |
1.55 V
|
1.55 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Qualification Status |
Not Qualified
|
|
Reference Standard |
MIL-19500/463G
|
|
Regulation Current-Nom (Ireg) |
1.4 mA
|
1.4 mA
|
Surface Mount |
YES
|
NO
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN OVER NICKEL
|
Terminal Form |
NO LEAD
|
WIRE
|
Terminal Position |
UNSPECIFIED
|
AXIAL
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2018-01-18
|
Additional Feature |
|
HIGH RELIABILITY
|
JEDEC-95 Code |
|
DO-35
|
Moisture Sensitivity Level |
|
1
|
Operating Temperature-Max |
|
200 °C
|
Operating Temperature-Min |
|
-65 °C
|
Peak Reflow Temperature (Cel) |
|
260
|
Power Dissipation-Max |
|
0.6 W
|
Rep Pk Reverse Voltage-Max |
|
100 V
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare JANHCA1N5301 with alternatives
Compare 1N5301PBFREE with alternatives