JANHCA1N4135C vs 1N3703BTR-RPCU feature comparison

JANHCA1N4135C Microsemi Corporation

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1N3703BTR-RPCU Central Semiconductor Corp

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP CENTRAL SEMICONDUCTOR CORP
Part Package Code DIE DO-41
Package Description DIE-2 O-PALF-W2
Pin Count 2 2
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection CATHODE ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 1500 Ω
JESD-30 Code S-XXUC-N2 O-PALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.25 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/435F
Reference Voltage-Nom 100 V 100 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Voltage Tol-Max 2%
Working Test Current 0.25 mA
Base Number Matches 4 1
Pbfree Code No

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