JANHCA1N4133 vs 1N5269 feature comparison

JANHCA1N4133 Microsemi Corporation

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1N5269 Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MOTOROLA INC
Part Package Code DIE
Package Description DIE-2 O-LALF-W2
Pin Count 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection CATHODE ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code S-XXUC-N2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/435F
Reference Voltage-Nom 87 V 87 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Voltage Tol-Max 5% 10%
Working Test Current 0.25 mA 1.4 mA
Base Number Matches 3 17
Dynamic Impedance-Max 370 Ω
JEDEC-95 Code DO-204AH
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Power Dissipation-Max 0.5 W
Reverse Current-Max 10 µA

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