JANHCA1N4119D
vs
JANTXV1N5544B-1
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DIE
DO-7
Package Description
DIE-2
HERMETIC SEALED, GLASS, DO-35, 2 PIN
Pin Count
2
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
CATHODE
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
200 Ω
JESD-30 Code
S-XXUC-N2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.25 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/435F
MIL-19500
Reference Voltage-Nom
28 V
28 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UNSPECIFIED
AXIAL
Voltage Tol-Max
1%
5%
Working Test Current
0.25 mA
1 mA
Base Number Matches
4
9
Pbfree Code
No
JEDEC-95 Code
DO-204AH
Operating Temperature-Min
-65 °C
Compare JANHCA1N4119D with alternatives
Compare JANTXV1N5544B-1 with alternatives