JANHCA1N4108C
vs
JANHCA1N4108C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
COMPENSATED DEVICES INC
Package Description
DIE-2
DIE-2
Reach Compliance Code
compliant
unknown
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
CATHODE
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
200 Ω
JESD-30 Code
S-XXUC-N2
S-XXUC-N2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
SQUARE
SQUARE
Package Style
UNCASED CHIP
UNCASED CHIP
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.25 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/435F
MIL-19500/435F
Reference Voltage-Nom
14 V
14 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UNSPECIFIED
UNSPECIFIED
Voltage Tol-Max
2%
2%
Working Test Current
0.25 mA
0.25 mA
Base Number Matches
1
1
Compare JANHCA1N4108C with alternatives
Compare JANHCA1N4108C with alternatives