JANHCA1N4106
vs
1N4106D-1
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
DIE-2
HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance Code
compliant
unknown
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
CATHODE
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
S-XXUC-N2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.48 W
Qualification Status
Qualified
Reference Standard
MIL-19500/435F
Reference Voltage-Nom
12 V
12 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UNSPECIFIED
AXIAL
Voltage Tol-Max
5%
1%
Working Test Current
0.25 mA
0.25 mA
Base Number Matches
4
8
Pbfree Code
No
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
200 Ω
JEDEC-95 Code
DO-204AH
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare JANHCA1N4106 with alternatives
Compare 1N4106D-1 with alternatives