JANHCA1N4106 vs 1N4106D-1 feature comparison

JANHCA1N4106 Microchip Technology Inc

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1N4106D-1 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description DIE-2 HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance Code compliant unknown
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection CATHODE ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code S-XXUC-N2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.48 W
Qualification Status Qualified
Reference Standard MIL-19500/435F
Reference Voltage-Nom 12 V 12 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Voltage Tol-Max 5% 1%
Working Test Current 0.25 mA 0.25 mA
Base Number Matches 4 8
Pbfree Code No
ECCN Code EAR99
HTS Code 8541.10.00.50
Dynamic Impedance-Max 200 Ω
JEDEC-95 Code DO-204AH
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C

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