JANHCA1N4102
vs
JANHCA1N4102D
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
DIE-2
DIE-2
Reach Compliance Code
compliant
compliant
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
CATHODE
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
S-XXUC-N2
S-XXUC-N2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
SQUARE
SQUARE
Package Style
UNCASED CHIP
UNCASED CHIP
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.25 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/435F
MIL-19500/435F
Reference Voltage-Nom
8.7 V
8.7 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UNSPECIFIED
UNSPECIFIED
Voltage Tol-Max
5%
1%
Working Test Current
0.25 mA
0.25 mA
Base Number Matches
3
1
Part Package Code
DIE
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
200 Ω
Operating Temperature-Max
200 °C
Compare JANHCA1N4102 with alternatives
Compare JANHCA1N4102D with alternatives