JANHCA1N4102 vs JANHCA1N4102D feature comparison

JANHCA1N4102 Microchip Technology Inc

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JANHCA1N4102D Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description DIE-2 DIE-2
Reach Compliance Code compliant compliant
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection CATHODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code S-XXUC-N2 S-XXUC-N2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape SQUARE SQUARE
Package Style UNCASED CHIP UNCASED CHIP
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.25 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/435F MIL-19500/435F
Reference Voltage-Nom 8.7 V 8.7 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form NO LEAD NO LEAD
Terminal Position UNSPECIFIED UNSPECIFIED
Voltage Tol-Max 5% 1%
Working Test Current 0.25 mA 0.25 mA
Base Number Matches 3 1
Part Package Code DIE
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Dynamic Impedance-Max 200 Ω
Operating Temperature-Max 200 °C

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Compare JANHCA1N4102D with alternatives