JAN2N6790
vs
IRFF222
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
DEFENSE LOGISTICS AGENCY
|
THOMSON CONSUMER ELECTRONICS
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.21.00.95
|
|
| Case Connection |
DRAIN
|
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
| DS Breakdown Voltage-Min |
200 V
|
|
| Drain Current-Max (ID) |
3.5 A
|
3 A
|
| Drain-source On Resistance-Max |
0.8 Ω
|
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JEDEC-95 Code |
TO-205AF
|
|
| JESD-30 Code |
O-MBCY-W3
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
METAL
|
|
| Package Shape |
ROUND
|
|
| Package Style |
CYLINDRICAL
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation Ambient-Max |
0.8 W
|
|
| Power Dissipation-Max (Abs) |
20 W
|
20 W
|
| Pulsed Drain Current-Max (IDM) |
14 A
|
|
| Qualification Status |
Qualified
|
|
| Reference Standard |
MIL-19500
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
BOTTOM
|
|
| Transistor Element Material |
SILICON
|
|
| Turn-off Time-Max (toff) |
100 ns
|
|
| Turn-on Time-Max (ton) |
90 ns
|
|
| Base Number Matches |
2
|
6
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare JAN2N6790 with alternatives